Chip to wafer direct bonding technologies for high density 3D integration
| Title: | Chip to wafer direct bonding technologies for high density 3D integration |
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| Authors: | Sanchez, L., Bally, L., Montmayeul, B., Fournel, F., Dafonseca, J., Augendre, E., Di Cioccio, L., Carron, V., Signamarcheix, T., Taibi, R., Mermoz, S., Lecarpentier, G. |
| Source: | 2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :1960-1964 May, 2012 |
| Relation: | 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9781467319645 9781467319669 9781467319652 |
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| ISSN: | 05695503 23775726 |
| DOI: | 10.1109/ECTC.2012.6249108 |
| Published in: | 2012 IEEE 62nd Electronic Components and Technology Conference, Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd |