In-Situ Method for TSV Delay Testing and Characterization Using Input Sensitivity Analysis

Bibliographic Details
Title: In-Situ Method for TSV Delay Testing and Characterization Using Input Sensitivity Analysis
Authors: You, J.-W., Huang, S.-Y., Lin, Y.-H., Tsai, M.-H., Kwai, D.-M., Chou, Y.-F., Wu, C.-W.
Source: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 21(3):443-453 Mar, 2013
Database: IEEE Xplore Digital Library