In-Situ Method for TSV Delay Testing and Characterization Using Input Sensitivity Analysis
Title: | In-Situ Method for TSV Delay Testing and Characterization Using Input Sensitivity Analysis |
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Authors: | You, J.-W., Huang, S.-Y., Lin, Y.-H., Tsai, M.-H., Kwai, D.-M., Chou, Y.-F., Wu, C.-W. |
Source: | IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 21(3):443-453 Mar, 2013 |
Database: | IEEE Xplore Digital Library |
ISSN: | 10638210 15579999 |
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DOI: | 10.1109/TVLSI.2012.2187543 |
Published in: | IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Very Large Scale Integration (VLSI) Systems, IEEE Transactions on, IEEE Trans. VLSI Syst. |