Novel packaging technique and its application to a wet/wet differential pressure silicon sensor

Bibliographic Details
Title: Novel packaging technique and its application to a wet/wet differential pressure silicon sensor
Authors: Krassow, H., Heimlich, D., Campabadal, F., Lora-Tamayo, E.
Source: Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97) Solid-state sensors and actuators Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on. 1:275-278 vol.1 1997
Relation: Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97)
Database: IEEE Xplore Digital Library