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Solder joints properties assessment in the terms of 4P Soldering Model

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Title: Solder joints properties assessment in the terms of 4P Soldering Model
Authors: Plotog, Ioan, Cucu, Traian, Mihailescu, Bogdan, Svasta, Paul, Branzei, Mihai, Tarcolea, Mihai, Miculescu, Florin, Thumm, Andreas, Flechtmann, Andreas
Source: 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for. :163-168 Oct, 2011
Relation: 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Database: IEEE Xplore Digital Library
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  Data: 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for. :163-168 Oct, 2011
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  Data: 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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RecordInfo BibRecord:
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        Value: 10.1109/SIITME.2011.6102710
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        PageCount: 6
        StartPage: 163
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            NameFull: Plotog, Ioan
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            NameFull: Cucu, Traian
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            NameFull: Svasta, Paul
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            NameFull: Miculescu, Florin
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            NameFull: Thumm, Andreas
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          Dates:
            – D: 01
              M: 10
              Type: published
              Y: 2011
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