Solder joints properties assessment in the terms of 4P Soldering Model
| Title: | Solder joints properties assessment in the terms of 4P Soldering Model |
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| Authors: | Plotog, Ioan, Cucu, Traian, Mihailescu, Bogdan, Svasta, Paul, Branzei, Mihai, Tarcolea, Mihai, Miculescu, Florin, Thumm, Andreas, Flechtmann, Andreas |
| Source: | 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for. :163-168 Oct, 2011 |
| Relation: | 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9781457712753 9781457712760 9781457712777 |
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| DOI: | 10.1109/SIITME.2011.6102710 |
| Published in: | 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME), Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for |