Plotog, I., Cucu, T., Mihailescu, B., Svasta, P., Branzei, M., Tarcolea, M., . . . Flechtmann, A. (2011). Solder joints properties assessment in the terms of 4P Soldering Model. 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME), Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for, 163-168. https://doi.org/10.1109/SIITME.2011.6102710

Plotog, Ioan, Traian Cucu, Bogdan Mihailescu, Paul Svasta, Mihai Branzei, Mihai Tarcolea, Florin Miculescu, Andreas Thumm, and Andreas Flechtmann. "Solder Joints Properties Assessment in the Terms of 4P Soldering Model." 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME), Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for 2011: 163-168. https://doi.org/10.1109/SIITME.2011.6102710.

Plotog, Ioan, et al. "Solder Joints Properties Assessment in the Terms of 4P Soldering Model." 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME), Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for, 2011, pp. 163-168, https://doi.org/10.1109/SIITME.2011.6102710.