| Title: |
Glass direct bonding technology for hermetic seal package |
| Authors: |
Ando, D., Oishi, K., Nakamura, T., Umeda, S. |
| Source: |
Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots Micro electro mechanical systems Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on. :186-190 1997 |
| Relation: |
Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots |
| Database: |
IEEE Xplore Digital Library |
