| Title: |
Wafer Backside CoatingTM of electrically conductive die attach adhesives for small IC packaging |
| Authors: |
Ling, Law Wai, Erfe, Eric, Vaquilar, Aldrin, Khor, Lily, Thong, K C, Yong, Nicole, Nam, Ng Peng, Winster, Tony, Hong, Xuan, Israel, Jonathan |
| Source: |
2009 11th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2009. EPTC '09. 11th. :750-753 Dec, 2009 |
| Relation: |
2009 11th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |
