Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low-$k$ Large-Die Flip Chip Package
| Title: | Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low-$k$ Large-Die Flip Chip Package |
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| Authors: | Ong, J. M. G., Tay, A. A. O., Zhang, X., Kripesh, V., Lim, Y. K., Yeo, D., Chan, K. C., Tan, J. B., Hsia, L. C., Sohn, D. K. |
| Source: | IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 32(4):838-848 Dec, 2009 |
| Database: | IEEE Xplore Digital Library |
| ISSN: | 15213331 15579972 |
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| DOI: | 10.1109/TCAPT.2009.2020696 |
| Published in: | IEEE Transactions on Components and Packaging Technologies, Components and Packaging Technologies, IEEE Transactions on, IEEE Trans. Comp. Packag. Technol. |