Bibliographic Details
| Title: |
Development of high density memory IC package by stacking IC chips |
| Authors: |
Nakanishi, H., Maruyama, T., Miyata, K., Ishio, T., Sota, Y., Narai, A., Fukunaga, S., Toyosawa, K., Fujita, K., Kada, M. |
| Source: |
1995 Proceedings. 45th Electronic Components and Technology Conference Electronic components and technology Electronic Components and Technology Conference, 1995. Proceedings., 45th. :634-640 1995 |
| Relation: |
1995 Proceedings. 45th Electronic Components and Technology Conference |
| Database: |
IEEE Xplore Digital Library |
