Thermo-mechanical analysis of a wafer level packaging by induction heating
| Title: | Thermo-mechanical analysis of a wafer level packaging by induction heating |
|---|---|
| Authors: | Wenming Liu, Mingxiang Chen, Yanyan Xi, Changyong Lin, Sheng Liu |
| Source: | 2008 International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on. :1-5 Jul, 2008 |
| Relation: | 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) |
| Database: | IEEE Xplore Digital Library |
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