Bibliographic Details
| Title: |
Thermo-mechanical analysis of a wafer level packaging by induction heating |
| Authors: |
Wenming Liu, Mingxiang Chen, Yanyan Xi, Changyong Lin, Sheng Liu |
| Source: |
2008 International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on. :1-5 Jul, 2008 |
| Relation: |
2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) |
| Database: |
IEEE Xplore Digital Library |
