Packaging and Feedthrough Modes of Wafer Level for RF MEMS Switches

Bibliographic Details
Title: Packaging and Feedthrough Modes of Wafer Level for RF MEMS Switches
Authors: Wu, Qun, He, Xun-jun, Jin, Bo-shi, Song, Ming-xin, Yin, Jing-hua
Source: 2006 International RF and Microwave Conference RF and Microwave Conference, 2006. RFM 2006. International. :165-168 Sep, 2006
Relation: 2006 International RF and Microwave Conference
Database: IEEE Xplore Digital Library
More Details
ISBN:0780397444
9780780397446
0780397452
9780780397453
DOI:10.1109/RFM.2006.331061
Published in:2006 International RF and Microwave Conference, RF and Microwave Conference, 2006. RFM 2006. International