Packaging and Feedthrough Modes of Wafer Level for RF MEMS Switches
Title: | Packaging and Feedthrough Modes of Wafer Level for RF MEMS Switches |
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Authors: | Wu, Qun, He, Xun-jun, Jin, Bo-shi, Song, Ming-xin, Yin, Jing-hua |
Source: | 2006 International RF and Microwave Conference RF and Microwave Conference, 2006. RFM 2006. International. :165-168 Sep, 2006 |
Relation: | 2006 International RF and Microwave Conference |
Database: | IEEE Xplore Digital Library |
ISBN: | 0780397444 9780780397446 0780397452 9780780397453 |
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DOI: | 10.1109/RFM.2006.331061 |
Published in: | 2006 International RF and Microwave Conference, RF and Microwave Conference, 2006. RFM 2006. International |