Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging
| Title: | Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging |
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| Authors: | Ivanova, M., Avenas, Y., Schaeffer, C., Dezord, J.-B., Schulz-Harder, J. |
| Source: | IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 21(6):1541-1547 Nov, 2006 |
| Database: | IEEE Xplore Digital Library |
| ISSN: | 08858993 19410107 |
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| DOI: | 10.1109/TPEL.2006.882974 |
| Published in: | IEEE Transactions on Power Electronics, Power Electronics, IEEE Transactions on, IEEE Trans. Power Electron. |