APA (7th ed.) Citation

Edelstein, D., Davis, C., Clevenger, L., Yoon, M., Cowley, A., Nogami, T., . . . Ivers, T. (2004). Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology. Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729), Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International, Interconnect technology, 214-216. https://doi.org/10.1109/IITC.2004.1345750

Chicago Style (17th ed.) Citation

Edelstein, D., et al. "Reliability, Yield, and Performance of a 90 Nm SOI/Cu/SiCOH Technology." Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729), Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International, Interconnect Technology 2004: 214-216. https://doi.org/10.1109/IITC.2004.1345750.

MLA (8th ed.) Citation

Edelstein, D., et al. "Reliability, Yield, and Performance of a 90 Nm SOI/Cu/SiCOH Technology." Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729), Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International, Interconnect Technology, 2004, pp. 214-216, https://doi.org/10.1109/IITC.2004.1345750.

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