Bibliographic Details
| Title: |
Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology |
| Authors: |
Edelstein, D., Davis, C., Clevenger, L., Yoon, M., Cowley, A., Nogami, T., Rathore, H., Agarwala, B., Arai, S., Carbone, A., Chanda, K., Cohen, S., Cote, W., Cullinan, M., Dalton, T., Das, S., Davis, P., Demarest, J., Dunn, D., Dziobkowski, C., Filippi, R., Fitzsimmons, J., Flaitz, P., Gates, S., Gill, J., Grill, A., Hawken, D., Ida, K., Klaus, D., Klymko, N., Lane, M., Lane, S., Lee, J., Landers, W., Li, W.-K., Lin, Y.-H., Liniger, E., Liu, X.-H., Madan, A., Malhotra, S., Martin, J., Molis, S., Muzzy, C., Nguyen, D., Nguyen, S., Ono, M., Parks, C., Questad, D., Restaino, D., Sakamoto, A., Shaw, T., Shimooka, Y., Simon, A., Simonyi, E., Tempest, S., Van Kleeck, T., Vogt, S., Wang, Y.-Y., Wille, W., Wright, J., Yang, C.-C., Ivers, T. |
| Source: |
Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Interconnect technology Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International. :214-216 2004 |
| Relation: |
Proceedings of the IEEE 2004 International Interconnect Technology Conference |
| Database: |
IEEE Xplore Digital Library |
