The integration of proton bombardment process into the manufacturing of mixed-signal/RF chips

Bibliographic Details
Title: The integration of proton bombardment process into the manufacturing of mixed-signal/RF chips
Authors: Tang, D.D., Lin, W.C., Lai, L.S., Wang, C.H., Lee, L.P., Hsu, H.M., Wu, C.M., Chang, C.W., Lien, W.Y., Chao, C.P., Lee, C.Y., Chern, G.J., Guo, J.C., Chang, C.S., Sun, Y.C., Du, D.S., Lan, K.C., Lin, L.F.
Source: IEEE International Electron Devices Meeting 2003 Electron devices IEDM'03 Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International. :28.6.1-28.6.4 2003
Relation: IEEE International Electron Devices Meeting 2003
Database: IEEE Xplore Digital Library