| Title: |
Enhancing DI Water Cleanability of Tacky Flux on Cu OSP Surface Using Flip-Chip Copper Pillar High-Density Interconnection |
| Authors: |
Huei, Yam Lip, Fen, Zhang Rui, Olakkankal, Edrina Risson, Kumar, B. Senthil, Sungsig, Kang, HanWen, Zhang |
| Source: |
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th. :497-500 Dec, 2024 |
| Relation: |
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |
