Enhancing Device Performance Through Non-Pressure Sintering on Copper Leadframes
| Title: | Enhancing Device Performance Through Non-Pressure Sintering on Copper Leadframes |
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| Authors: | Bayaras, Danila, Abito, Kumar, B. Senthil, Yu, Liu, Qing, Tan Tze, Yile, Liao, Kang, SS |
| Source: | 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th. :710-713 Dec, 2024 |
| Relation: | 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9798331522001 |
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| DOI: | 10.1109/EPTC62800.2024.10909862 |
| Published in: | 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th |