Mastering Complexity: A Solder Material Solution to Manage Component Warpage and Uneven Thermal Gradients in Modern Electronics Manufacturing
| Title: | Mastering Complexity: A Solder Material Solution to Manage Component Warpage and Uneven Thermal Gradients in Modern Electronics Manufacturing |
|---|---|
| Authors: | Brennan, Kevin, Lasky, Ronald C. |
| Source: | 2025 Pan Pacific Strategic Electronics Symposium (Pan Pacific) Pan Pacific Strategic Electronics Symposium (Pan Pacific), 2025. :1-6 Jan, 2025 |
| Relation: | 2025 Pan Pacific Strategic Electronics Symposium (Pan Pacific) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9781944543358 |
|---|---|
| DOI: | 10.23919/PanPacific65826.2025.10908938 |
| Published in: | 2025 Pan Pacific Strategic Electronics Symposium (Pan Pacific), Pan Pacific Strategic Electronics Symposium (Pan Pacific), 2025 |