Bibliographic Details
| Title: |
37.4 SHINSAI: A 586mm2 Reusable Active TSV Interposer with Programmable Interconnect Fabric and 512Mb 3D Underdeck Memory |
| Authors: |
Jiao, Bo, Zhu, Haozhe, Zeng, Yuman, Li, Yongjiang, Liao, Jie, Jia, Siyao, Tian, Mochen, Chen, Zexing, Zhu, Jundong, Wen, Dexin, Wang, Yan, Wang, Yu, Xu, Jian, Wang, Feng, Tao, Jun, Chen, Chixiao, Liu, Qi, Liu, Ming |
| Source: |
2025 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2025 IEEE International. 68:01-03 Feb, 2025 |
| Relation: |
2025 IEEE International Solid-State Circuits Conference (ISSCC) |
| Database: |
IEEE Xplore Digital Library |
