Bibliographic Details
| Title: |
Vertically Integrated Active Power Delivery Network (PDN) for Heterogenous 3D (H3D) Stacked Systems: 3D On-Chip Integration of GaN Power Devices on PDN with Direct Heat Spreading Layer Bonding |
| Authors: |
Jeong, Jaeyong, Lee, Chan Jik, Choi, Sung Joon, Rheem, Nahyun, Song, Minseo, Suh, Yoon-Je, Kim, Bong Ho, Kim, Joon Pyo, Shim, Joonsup, Lee, Jiseon, Park, Myungsoo, Koh, Yumin, Kim, Donghyun, Kim, Sanghyeon |
| Source: |
2024 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2024 IEEE International. :1-4 Dec, 2024 |
| Relation: |
2024 IEEE International Electron Devices Meeting (IEDM) |
| Database: |
IEEE Xplore Digital Library |
