Conference
View in EDS

Advanced Collaboration in the Romanian Electronics Field based on the TIE Professional Student Contest

Bibliographic Details
Title: Advanced Collaboration in the Romanian Electronics Field based on the TIE Professional Student Contest
Authors: Cenusa, Mihai, Viman, Liviu, Svasta, Paul, Codreanu, Norocel, Popescu, Bogdan, Durus, Florin, Pantazica, Mihaela
Source: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2024 IEEE 30th International Symposium for. :487-493 Oct, 2024
Relation: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Database: IEEE Xplore Digital Library
FullText Text:
  Availability: 0
CustomLinks:
  – Url: https://login.libproxy.scu.edu/login?url=https://ieeexplore.ieee.org/document/10814785
    Name: EDS - IEEE (s8985755)
    Category: fullText
    Text: Check IEEE Xplore for full text
    MouseOverText: Check IEEE Xplore for full text. A new window will open.
  – Url: https://resolver.ebsco.com/c/xy5jbn/result?sid=EBSCO:edseee&genre=book&issn=26427036&ISBN=9798331539511&volume=&issue=&date=&spage=487&pages=487-493&title=2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME), Design and Technology in Electronic Packaging (SIITME), 2024 IEEE 30th International Symposium for&atitle=Advanced%20Collaboration%20in%20the%20Romanian%20Electronics%20Field%20based%20on%20the%20TIE%20Professional%20Student%20Contest&aulast=Cenusa%2C%20Mihai&id=DOI:10.1109/SIITME63973.2024.10814785
    Name: Full Text Finder (for New FTF UI) (s8985755)
    Category: fullText
    Text: Find It @ SCU Libraries
    MouseOverText: Find It @ SCU Libraries
Header DbId: edseee
DbLabel: IEEE Xplore Digital Library
An: edseee.10814785
RelevancyScore: 1158
AccessLevel: 2
PubType: Conference
PubTypeId: conference
PreciseRelevancyScore: 1158.01867675781
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Advanced Collaboration in the Romanian Electronics Field based on the TIE Professional Student Contest
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Cenusa%2C+Mihai%22">Cenusa, Mihai</searchLink><br /><searchLink fieldCode="AR" term="%22Viman%2C+Liviu%22">Viman, Liviu</searchLink><br /><searchLink fieldCode="AR" term="%22Svasta%2C+Paul%22">Svasta, Paul</searchLink><br /><searchLink fieldCode="AR" term="%22Codreanu%2C+Norocel%22">Codreanu, Norocel</searchLink><br /><searchLink fieldCode="AR" term="%22Popescu%2C+Bogdan%22">Popescu, Bogdan</searchLink><br /><searchLink fieldCode="AR" term="%22Durus%2C+Florin%22">Durus, Florin</searchLink><br /><searchLink fieldCode="AR" term="%22Pantazica%2C+Mihaela%22">Pantazica, Mihaela</searchLink>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2024 IEEE 30th International Symposium for. :487-493 Oct, 2024
– Name: NoteTitleSource
  Label: Relation
  Group: SrcInfo
  Data: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME)
PLink https://login.libproxy.scu.edu/login?url=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edseee&AN=edseee.10814785
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1109/SIITME63973.2024.10814785
    PhysicalDescription:
      Pagination:
        PageCount: 7
        StartPage: 487
    Titles:
      – TitleFull: Advanced Collaboration in the Romanian Electronics Field based on the TIE Professional Student Contest
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Cenusa, Mihai
      – PersonEntity:
          Name:
            NameFull: Viman, Liviu
      – PersonEntity:
          Name:
            NameFull: Svasta, Paul
      – PersonEntity:
          Name:
            NameFull: Codreanu, Norocel
      – PersonEntity:
          Name:
            NameFull: Popescu, Bogdan
      – PersonEntity:
          Name:
            NameFull: Durus, Florin
      – PersonEntity:
          Name:
            NameFull: Pantazica, Mihaela
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 16
              M: 10
              Type: published
              Y: 2024
          Identifiers:
            – Type: isbn-print
              Value: 9798331539511
            – Type: issn-print
              Value: 26427036
            – Type: issn-locals
              Value: edseee.IEEEConferenc
          Titles:
            – TitleFull: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME), Design and Technology in Electronic Packaging (SIITME), 2024 IEEE 30th International Symposium for
              Type: main
ResultId 1