Bibliographic Details
| Title: |
Advanced Collaboration in the Romanian Electronics Field based on the TIE Professional Student Contest |
| Authors: |
Cenusa, Mihai, Viman, Liviu, Svasta, Paul, Codreanu, Norocel, Popescu, Bogdan, Durus, Florin, Pantazica, Mihaela |
| Source: |
2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2024 IEEE 30th International Symposium for. :487-493 Oct, 2024 |
| Relation: |
2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) |
| Database: |
IEEE Xplore Digital Library |
