| Title: |
Application of Surface Activated Bonding to Determine the Dislocation Generation Process at Asymmetric Grain Boundaries in Silicon |
| Authors: |
Ohno, Yutaka, Saito, Hikaru, Liang, Jianbo, Shigekawa, Naoteru, Yokoi, Tatsuya, Matsunaga, Katsuyuki, Inoue, Koji, Nagai, Yasuyoshi, Hata, Satoshi |
| Source: |
2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024 |
| Relation: |
2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| Database: |
IEEE Xplore Digital Library |
