Bibliographic Details
| Title: |
20-mm-Square GaN/Diamond Bonding Without Vacuum Process |
| Authors: |
Matsumae, Takashi, Kurashima, Yuichi, Takahashi, Yukiko, Akabane, Yuko, Takagi, Hideki |
| Source: |
2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024 |
| Relation: |
2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| Database: |
IEEE Xplore Digital Library |
