Bibliographic Details
| Title: |
Aging Effect on Drop-Shock Reliability of SnAgCu305 Solder Alloy |
| Authors: |
Daradkeh, Saddam, Vyas, Palash Pranav, Alakayleh, Abdallah, El Amine Belhadi, Mohamed, Tahat, Sufyan, Alahmer, Ali, Hamasha, Sa'd |
| Source: |
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-8 May, 2024 |
| Relation: |
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| Database: |
IEEE Xplore Digital Library |
