Research on Pull-Off Strength Test Method of Cross-Surface SiP Device
| Title: | Research on Pull-Off Strength Test Method of Cross-Surface SiP Device |
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| Authors: | Wang, Shinan, Wan, Yongkang, Meng, Zhichao, Yu, Yongjian |
| Source: | 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024 |
| Relation: | 2024 25th International Conference on Electronic Packaging Technology (ICEPT) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9798350353808 |
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| ISSN: | 28369734 |
| DOI: | 10.1109/ICEPT63120.2024.10668603 |
| Published in: | 2024 25th International Conference on Electronic Packaging Technology (ICEPT), Electronic Packaging Technology (ICEPT), 2024 25th International Conference on |