20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

Bibliographic Details
Title:	20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering
Authors:	Ji, Xinrui, Du, Leiming, van Zeijl, Henk, Zhang, Guoqi, Derakhshandeh, Jaber, Beyne, Eric
Source:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1891-1895 May, 2024
Relation:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
Database:	IEEE Xplore Digital Library

More Details
ISBN:	9798350375985
ISSN:	23775726
DOI:	10.1109/ECTC51529.2024.00221
Published in:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th, ECTC