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Thermal and mechanical simulations of 3D packages with custom high bandwidth memory (HBM)

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Title: Thermal and mechanical simulations of 3D packages with custom high bandwidth memory (HBM)
Authors: Chatterjee, Kamalika, Li, Yan, Chang, Hochan, Damadam, Mohsen, Asrar, Pouya, Kim, Jaechoon, Jeong, Glen, Kim, WooPoung
Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1054-1059 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
Database: IEEE Xplore Digital Library
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  Data: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1054-1059 May, 2024
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1109/ECTC51529.2024.00169
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            NameFull: Chatterjee, Kamalika
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            NameFull: Li, Yan
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            NameFull: Chang, Hochan
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            NameFull: Damadam, Mohsen
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            NameFull: Asrar, Pouya
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            NameFull: Kim, Jaechoon
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            NameFull: Jeong, Glen
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            NameFull: Kim, WooPoung
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            – D: 28
              M: 05
              Type: published
              Y: 2024
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