Bibliographic Details
| Title: |
Thermal and mechanical simulations of 3D packages with custom high bandwidth memory (HBM) |
| Authors: |
Chatterjee, Kamalika, Li, Yan, Chang, Hochan, Damadam, Mohsen, Asrar, Pouya, Kim, Jaechoon, Jeong, Glen, Kim, WooPoung |
| Source: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1054-1059 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |
