Bibliographic Details
| Title: |
An Advanced Packaging Figure of Merit (AP-FoM) for Benchmarking of Heterogeneous Integration Technologies |
| Authors: |
Wang, Chuei-Tang, Shang, Shu-An, Hsiao, Yu-Ming, Lii, Mirng-Ji, Lee, Kam Heng, He, Jun |
| Source: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1093-1097 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |
