In Situ Analysis of Copper Microstructures in Electromigration Using SEM-EBSD Techniques
| Title: | In Situ Analysis of Copper Microstructures in Electromigration Using SEM-EBSD Techniques |
|---|---|
| Authors: | Zhang, Yaqian, Yan, Yixin, Vollebregt, Sten, Zhang, Guoqi |
| Source: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1317-1321 May, 2024 |
| Relation: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |
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