In Situ Analysis of Copper Microstructures in Electromigration Using SEM-EBSD Techniques
| Title: | In Situ Analysis of Copper Microstructures in Electromigration Using SEM-EBSD Techniques |
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| Authors: | Zhang, Yaqian, Yan, Yixin, Vollebregt, Sten, Zhang, Guoqi |
| Source: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1317-1321 May, 2024 |
| Relation: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |
| ISBN: | 9798350375985 |
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| ISSN: | 23775726 |
| DOI: | 10.1109/ECTC51529.2024.00214 |
| Published in: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th, ECTC |