Fin Design Topology Optimization for Direct Liquid Cooling of Multichip Power Modules
| Title: | Fin Design Topology Optimization for Direct Liquid Cooling of Multichip Power Modules |
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| Authors: | Lad, A.A., Roman, E., Zhao, Y., King, W.P., Miljkovic, N. |
| Source: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(5):795-809 May, 2024 |
| Database: | IEEE Xplore Digital Library |
| ISSN: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2024.3363050 |
| Published in: | IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manufact. Technol. |