Bibliographic Details
| Title: |
Reliability Aspects and Study of Copper Seed Deposition on Polyimide via Sputtering |
| Authors: |
Yojo, Leonardo Shimizu, Santos, Favero Guilherme, Pontes, Fagnaldo Braga, Dos Santos, Carlos R. P., Hasenkamp, Willyan, Dutra e Silva, Elvio C. |
| Source: |
2023 37th Symposium on Microelectronics Technology and Devices (SBMicro) Microelectronics Technology and Devices (SBMicro), 2023 37th Symposium on. :1-4 Aug, 2023 |
| Relation: |
2023 37th Symposium on Microelectronics Technology and Devices (SBMicro) |
| Database: |
IEEE Xplore Digital Library |
