Bibliographic Details
Title: |
Combined Thermo-Reflectance and Thin-Film Coating in Near-Field Imaging of Chip-Package-PCB-Antenna Modules for Industrial-Testing and Failure Analysis |
Authors: |
Wane, S., Kendig, D., Dinh, T.V., Alkhalifeh, K., Cabrera, A. E., Tran, Q.H., Shakouri, M., Shakouri, A., Salmon, L., Molnar, G., Ridier, K., Bajon, D., Nyssens, L., Pip, A., Vanbrabant, M., Rack, M., Tihon, D., Craeye, C., Simon, P., Raskin, J.-P., Lederer, D., Bousseksou, A. |
Source: |
2023 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS) Wireless and Microwave Circuits and Systems (WMCS), 2023 IEEE Texas Symposium on. :1-6 Apr, 2023 |
Relation: |
2023 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS) |
Database: |
IEEE Xplore Digital Library |