Bibliographic Details
| Title: |
BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond |
| Authors: |
Thareja, Gaurav, Pal, Ashish, Wang, Xingye, Dag, Sefa, You, Shi, Sharma, Shashank, Zhu, Qing, Cervantes, Carmen L., Hwang, Shinjae, Spuller, Matthew, Ng, Ben, Kumar, Pradeep S., Tam, Norman, Gage, Max, Deshpande, Sameer, Wu, Zhiyuan, Jansen, Alexander, Dey, Liton, Chen, Feng, Xie, Xianjin, Kashefizadeh, Keyvan, Reddy, Vinod, Lo, Andy, Chen, Zhebo, Huey, Sidney, Tang, Jianshe, Ren, He, Naik, Mehul, Brown, Brian, Kesapragada, Sree, Sangamali, Buvna Ayyagari, Bazizi, El Mehdi, Tang, Xianmin |
| Source: |
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023 |
| Relation: |
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) |
| Database: |
IEEE Xplore Digital Library |
