Zhu, X., Rajoo, R., Nistala, R. R., & Mo, Z. Q. (2022). Comparison of Mechanical Properties of Nickel-Palladium Plated and Tin-Plated Copper Leadframe Material at Elevated Temperatures. 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th, 753-758. https://doi.org/10.1109/EPTC56328.2022.10013296

Zhu, Xintong, Ranjan Rajoo, Ramesh Rao Nistala, and Zhi Qiang Mo. "Comparison of Mechanical Properties of Nickel-Palladium Plated and Tin-Plated Copper Leadframe Material at Elevated Temperatures." 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th 2022: 753-758. https://doi.org/10.1109/EPTC56328.2022.10013296.

Zhu, Xintong, et al. "Comparison of Mechanical Properties of Nickel-Palladium Plated and Tin-Plated Copper Leadframe Material at Elevated Temperatures." 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th, 2022, pp. 753-758, https://doi.org/10.1109/EPTC56328.2022.10013296.