Bibliographic Details
| Title: |
Comparison of Mechanical Properties of Nickel-Palladium Plated and Tin-Plated Copper Leadframe Material at Elevated Temperatures |
| Authors: |
Zhu, Xintong, Rajoo, Ranjan, Nistala, Ramesh Rao, Mo, Zhi Qiang |
| Source: |
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :753-758 Dec, 2022 |
| Relation: |
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |
