Influence of thermal growth parameters on the SiO2/4H-SiC interfacial region
Title: | Influence of thermal growth parameters on the SiO2/4H-SiC interfacial region |
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Authors: | E. Pitthan, L. D. Lopes, R. Palmieri, S. A. CorrĂȘa, G. V. Soares, H. I. Boudinov, F. C. Stedile |
Source: | APL Materials, Vol 1, Iss 2, Pp 022101-022101 (2013) |
Publisher Information: | AIP Publishing LLC, 2013. |
Publication Year: | 2013 |
Collection: | LCC:Biotechnology LCC:Physics |
Subject Terms: | Biotechnology, TP248.13-248.65, Physics, QC1-999 |
More Details: | In order to elucidate the origin of SiC electrical degradation from thermal oxidation, 4H-SiC substrates were thermally oxidized under different conditions of time and pressure. Results from nuclear reaction analyses were correlated to those from electrical measurements. Although the increase in the flatband voltage shift and in the film thickness were related to the oxidation parameters, the results exclude the thickness of the SiO2/4H-SiC interfacial region and the amount of residual oxygen compounds present on the SiC surface as the main cause of the electrical degradation from the SiC oxidation. |
Document Type: | article |
File Description: | electronic resource |
Language: | English |
ISSN: | 2166-532X 34642471 |
Relation: | https://doaj.org/toc/2166-532X |
DOI: | 10.1063/1.4817896 |
Access URL: | https://doaj.org/article/cbe3eaa3464247128309368b0c9f5e0d |
Accession Number: | edsdoj.be3eaa3464247128309368b0c9f5e0d |
Database: | Directory of Open Access Journals |
ISSN: | 2166532X 34642471 |
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DOI: | 10.1063/1.4817896 |
Published in: | APL Materials |
Language: | English |