Influence of thermal growth parameters on the SiO2/4H-SiC interfacial region

Bibliographic Details
Title: Influence of thermal growth parameters on the SiO2/4H-SiC interfacial region
Authors: E. Pitthan, L. D. Lopes, R. Palmieri, S. A. CorrĂȘa, G. V. Soares, H. I. Boudinov, F. C. Stedile
Source: APL Materials, Vol 1, Iss 2, Pp 022101-022101 (2013)
Publisher Information: AIP Publishing LLC, 2013.
Publication Year: 2013
Collection: LCC:Biotechnology
LCC:Physics
Subject Terms: Biotechnology, TP248.13-248.65, Physics, QC1-999
More Details: In order to elucidate the origin of SiC electrical degradation from thermal oxidation, 4H-SiC substrates were thermally oxidized under different conditions of time and pressure. Results from nuclear reaction analyses were correlated to those from electrical measurements. Although the increase in the flatband voltage shift and in the film thickness were related to the oxidation parameters, the results exclude the thickness of the SiO2/4H-SiC interfacial region and the amount of residual oxygen compounds present on the SiC surface as the main cause of the electrical degradation from the SiC oxidation.
Document Type: article
File Description: electronic resource
Language: English
ISSN: 2166-532X
34642471
Relation: https://doaj.org/toc/2166-532X
DOI: 10.1063/1.4817896
Access URL: https://doaj.org/article/cbe3eaa3464247128309368b0c9f5e0d
Accession Number: edsdoj.be3eaa3464247128309368b0c9f5e0d
Database: Directory of Open Access Journals
More Details
ISSN:2166532X
34642471
DOI:10.1063/1.4817896
Published in:APL Materials
Language:English