Bibliographic Details
| Title: |
Effects of Hf addition on the microstructure and properties of Cu-Sn-P alloy |
| Authors: |
Biao Wei, Haoren Yang, Chen Wang, Jianhui Zhou, Lei Xiao, Tianyu Ma, Bingshu Wang |
| Source: |
Journal of Materials Research and Technology, Vol 33, Iss , Pp 2981-2988 (2024) |
| Publisher Information: |
Elsevier, 2024. |
| Publication Year: |
2024 |
| Collection: |
LCC:Mining engineering. Metallurgy |
| Subject Terms: |
Cu-Sn-P, Hf element, Mechanical properties, Electrical conductivity, Microstructure, Mining engineering. Metallurgy, TN1-997 |
| More Details: |
In this paper, the effects of Hf addition on the mechanical properties, electrical conductivity and microstructure of Cu-Sn-P alloy were investigated. The results show that the Hf addition can enhance the mechanical properties and electrical conductivity of Cu-Sn-P alloy. The alloy with 0.05 wt% Hf exhibits the best comprehensive performance with yield strength of 625 MPa, tensile strength of 661 MPa and electrical conductivity of 16.8 %IACS. Compared with the Cu-Sn-P alloy without Hf addition, the yield strength and tensile strength are increased by 8.4% and 7.8%, and the electrical conductivity is increased by 24.4%. The increase in the strength of Hf-added alloy can be attributed to the synergistic effect of multiple strengthening mechanisms, including fine grain strengthening, twin strengthening, dislocation strengthening, precipitation strengthening and Σ3n (n = 1, 2, 3) grain boundary strengthening. Moreover, the Hf-P precipitates can be observed in the Hf-added alloy. According to the amount of Hf addition, these precipitates can manifest as the fine HfP2 phase and the coarse HfP phase. The formation of Hf-P precipitates contributes to the precipitation strengthening and the purification of Cu matrix, thus contributing to the improvement of strength and conductivity. |
| Document Type: |
article |
| File Description: |
electronic resource |
| Language: |
English |
| ISSN: |
2238-7854 |
| Relation: |
http://www.sciencedirect.com/science/article/pii/S2238785424023032; https://doaj.org/toc/2238-7854 |
| DOI: |
10.1016/j.jmrt.2024.10.033 |
| Access URL: |
https://doaj.org/article/cde9b6ae61fb478aa72fa31c2919e267 |
| Accession Number: |
edsdoj.9b6ae61fb478aa72fa31c2919e267 |
| Database: |
Directory of Open Access Journals |
