Bibliographic Details
| Title: |
A Low-Power and Robust Micromachined Thermal Convective Accelerometer |
| Authors: |
Yizhou Ye, Shu Wan, Chen Hou, Xuefeng He, Shunbo Li |
| Source: |
Micromachines, Vol 15, Iss 7, p 844 (2024) |
| Publisher Information: |
MDPI AG, 2024. |
| Publication Year: |
2024 |
| Collection: |
LCC:Mechanical engineering and machinery |
| Subject Terms: |
accelerometer, thermal convection, MEMS, tilt sensor, Mechanical engineering and machinery, TJ1-1570 |
| More Details: |
This paper presents a micromachined thermal convective accelerometer with low power and high reliability. This accelerometer comprises a heater and two thermistors. The central heater elevates the temperature of the chip above ambient levels while the symmetrically arranged thermistors monitor the temperature differentials induced by acceleration. The heater and thermistors are fabricated on a glass substrate using a standard micro-electromechanical systems (MEMS) process flow, and the fabricated sensor is installed on a rotation platform and a shaking table experimental setup to perform the experiment. The results indicate that the sensor has the capability to measure accelerations surpassing 80 m/s2, with an approximate linear sensitivity of 110.69 mV/g. This proposed thermal convective accelerometer offers promising potential for various applications requiring precise acceleration measurements in environments where low power consumption and high reliability are paramount. |
| Document Type: |
article |
| File Description: |
electronic resource |
| Language: |
English |
| ISSN: |
2072-666X |
| Relation: |
https://www.mdpi.com/2072-666X/15/7/844; https://doaj.org/toc/2072-666X |
| DOI: |
10.3390/mi15070844 |
| Access URL: |
https://doaj.org/article/1aa3bd12c42d4f8da7b5817b80a5e5ac |
| Accession Number: |
edsdoj.1aa3bd12c42d4f8da7b5817b80a5e5ac |
| Database: |
Directory of Open Access Journals |
