Modeling and Analysis of Vibration Coupling in Differential Common-Based MEMS Resonators

Bibliographic Details
Title: Modeling and Analysis of Vibration Coupling in Differential Common-Based MEMS Resonators
Authors: Jing Zhang, Zhuo Yang, Tianhao Wu, Zhichao Yao, Chen Lin, Yan Su
Source: Micromachines, Vol 16, Iss 2, p 169 (2025)
Publisher Information: MDPI AG, 2025.
Publication Year: 2025
Collection: LCC:Mechanical engineering and machinery
Subject Terms: differential common-based MEMS resonators (DCMR), vibration coupling, silicon resonant accelerometer (SRA), coupling stiffness, Mechanical engineering and machinery, TJ1-1570
More Details: In differential MEMS resonant sensors, a pair of resonators are interconnected with other structural components while sharing a common substrate. This leads to mutual coupling of vibration energy between resonators, interfering with their frequency outputs and affecting the sensor’s static performance. This paper aims to model and analyze the vibration coupling phenomena in differential common-based MEMS resonators (DCMR). A mechanical model of the DCMR structure was established and refined through finite element simulation analysis. Theoretical calculations yielded vibration coupling curves for two typical silicon resonant accelerometer (SRA) structures containing DCMR: SRA-V1 and SRA-V2, with coupling stiffness values of 2.361 × 10−4 N/m and 1.370 × 10−2 N/m, respectively. An experimental test system was constructed to characterize the vibration coupling behavior. The results provided coupling amplitude-frequency characteristic curves and coupling stiffness values (7.073 × 10−4 N/m and 1.068 × 10−2 N/m for SRA-V1 and SRA-V2, respectively) that validated the theoretical analysis and computational model. This novel approach enables effective evaluation of coupling intensity between 5resonators and provides a theoretical foundation for optimizing device structural designs.
Document Type: article
File Description: electronic resource
Language: English
ISSN: 2072-666X
Relation: https://www.mdpi.com/2072-666X/16/2/169; https://doaj.org/toc/2072-666X
DOI: 10.3390/mi16020169
Access URL: https://doaj.org/article/160f743be3ee444face9438f69206f7c
Accession Number: edsdoj.160f743be3ee444face9438f69206f7c
Database: Directory of Open Access Journals
More Details
ISSN:2072666X
DOI:10.3390/mi16020169
Published in:Micromachines
Language:English