Mechanism for Adhesion of Epoxy Resin to Copper Substrate through C-H-Si Amorphous Thin Film
| Title: | Mechanism for Adhesion of Epoxy Resin to Copper Substrate through C-H-Si Amorphous Thin Film |
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| Authors: | Yamada, Yuka, Fukumoto, Shinji, Fujimoto, Kozo |
| Source: | Sumato Purosesu Gakkaishi. 10(5):308-315 |
| Availability: | http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN628158093&indx=1&recIds=ETOCRN628158093 |
| Database: | British Library Document Supply Centre Inside Serials & Conference Proceedings |
| ISSN: | 2186702X |
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| Published in: | Sumato Purosesu Gakkaishi |
| Language: | Other |