Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints
| Title: | Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints |
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| Authors: | Liang, C. L., Lin, K. L., Peng, J. W. |
| Source: | JOURNAL OF ELECTRONIC MATERIALS. 45(1):51-56 |
| Availability: | http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN374058925&indx=1&recIds=ETOCRN374058925 |
| Database: | British Library Document Supply Centre Inside Serials & Conference Proceedings |
| ISSN: | 03615235 |
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| Published in: | JOURNAL OF ELECTRONIC MATERIALS |
| Language: | English |