Bibliographic Details
Title: |
Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint (p311) Thermal and thermomechanical phenomena in electronic systems (Conference) |
Authors: |
El Amine Belhadi, Mohamed, Akkara, Francy John, Hoque, Mohd Aminul, Vyas, Palash Pranav, Wei, Xin, Shmatok, Andrii, Hamasha, Sa'd, Prorok, Barton Charles, Suhling, Jeff, Lall, Pradeep |
Source: |
ITHERM. 19(2):904-910 |
Availability: |
http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN607084992&indx=1&recIds=ETOCCN607084992 |
Database: |
British Library Document Supply Centre Inside Serials & Conference Proceedings |