Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint (p311)

Bibliographic Details
Title: Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint (p311)
Thermal and thermomechanical phenomena in electronic systems (Conference)
Authors: El Amine Belhadi, Mohamed, Akkara, Francy John, Hoque, Mohd Aminul, Vyas, Palash Pranav, Wei, Xin, Shmatok, Andrii, Hamasha, Sa'd, Prorok, Barton Charles, Suhling, Jeff, Lall, Pradeep
Source: ITHERM. 19(2):904-910
Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN607084992&indx=1&recIds=ETOCCN607084992
Database: British Library Document Supply Centre Inside Serials & Conference Proceedings
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ISSN:19363958
Published in:ITHERM
Language:English