| Title: |
Key Technologies to Implement High Thermal Ambient Data Center
ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems |
| Authors: |
Zhang, Shu, Han, Yu, Ahuja, Nishi, Liu, Xiaohong, Ren, Huahua, Guo, Guangliang |
| Source: |
IPACK. 1:V001T09A010-V001T09A010 |
| Availability: |
http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN604034113&indx=1&recIds=ETOCCN604034113 |
| Database: |
British Library Document Supply Centre Inside Serials & Conference Proceedings |
