Creep Tendencies of Cu-Al Thin Wires Submitted to Moderate Temperature Conditions: Influence of Intermetallic Compounds
| Title: | Creep Tendencies of Cu-Al Thin Wires Submitted to Moderate Temperature Conditions: Influence of Intermetallic Compounds Processing & manufacturing of advanced materials; THERMEC 2016 |
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| Authors: | Gueydan, A., Hug, E. |
| Source: | Materials science forum. 879(1):631-636 |
| Availability: | http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN602143348&indx=1&recIds=ETOCCN602143348 |
| Database: | British Library Document Supply Centre Inside Serials & Conference Proceedings |
| ISSN: | 02555476 |
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| Published in: | Materials science forum |
| Language: | English |