Bibliographic Details
Title: |
Defect analysis of thin film Si-based alloys deposited by hot-wire CVD using junction capacitance methods International conference on Hot-wire CVD |
Authors: |
Cohen, J. D., Datta, S., Palinginis, K., Mahan, A. H., Iwaniczko, E., Xu, Y., Branz, H. M. |
Source: |
THIN SOLID FILMS. 516(5):663-669 |
Availability: |
http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN067077956&indx=1&recIds=ETOCCN067077956 |
Database: |
British Library Document Supply Centre Inside Serials & Conference Proceedings |