Defect analysis of thin film Si-based alloys deposited by hot-wire CVD using junction capacitance methods

Bibliographic Details
Title: Defect analysis of thin film Si-based alloys deposited by hot-wire CVD using junction capacitance methods
International conference on Hot-wire CVD
Authors: Cohen, J. D., Datta, S., Palinginis, K., Mahan, A. H., Iwaniczko, E., Xu, Y., Branz, H. M.
Source: THIN SOLID FILMS. 516(5):663-669
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Database: British Library Document Supply Centre Inside Serials & Conference Proceedings
More Details
ISSN:00406090
Published in:THIN SOLID FILMS
Language:English